Bhaskar Mitra, Electrical Engineering, IIT Delhi

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This semester

ELL7320
Fundamentals of Microelectronic Device and Systems Packagingrunning now
3 (3-0-0) credits · Slot X
unrated
ELL7332
Introduction to MEMS Designrunning now
3 (3-0-0) credits · Slot X
unrated

Earlier

ELL231
Power Electronics and Energy Devices
3 (3-0-0) credits · Sem 2, 2025-26, Sem 2, 2024-25, Sem 2, 2023-24
unrated
ELL1401
Digital Electronicsrunning now
4.5 (3-0-3) credits · Sem 1, 2025-26
unrated
ELL834
Selected Topics in IEC-IIrunning now
3 (3-0-0) credits · Sem 1, 2025-26
unrated
ELD830
Minor Projectrunning now
3 (0-0-6) credits · Sem 1, 2024-25, Sem 2, 2023-24, Sem 1, 2023-24, Sem 2, 2022-23
unrated
ELD831
Major Project Part-I (Integrated Electronic Circuits)running now
6 (0-0-12) credits · Sem 1, 2024-25, Sem 2, 2023-24, Sem 1, 2023-24, Sem 2, 2022-23, Sem 1, 2022-23

Each course has its own page and discussion.

Doing a BTP, MTP, PhD, internship or RA position under Mitra, scored on five separate axes.

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Mentorship5

1 · left yourself to itclosely guided · 10

Availability5

1 · weeks to get a replyresponds same day · 10

Freedom5

1 · told exactly what to dopicked my own direction · 10

Workload5

1 · lightpunishing · 10

Credit5

1 · contribution went unacknowledgedscrupulously fair on authorship · 10

These are deliberately not all “high is good”. Someone who wants heavy guidance and someone who wants total autonomy are looking for opposite ends of the Freedom axis. Answer honestly about what it was like; readers will judge fit.

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Areas listed by the department

MEMSMicrofabricationMicrofluidicsPlastic MEMSMicroplasmasGas Phase Nanofluidics

Publications, via OpenAlex

8h-index

320Citations

56Works

7i10

Topic clusters

Advanced MEMS and NEMS TechnologiesPlasma Applications and DiagnosticsDielectric materials and actuatorsAdvanced Sensor and Energy Harvesting MaterialsAcoustic Wave Resonator Technologies

Most recent

Study of Electrical and Mechanical Properties of PVDF-TrFE/KNN Composite Film with Flexible Energy Harvesting Application · ACS Applied Electronic Materials, 2026 · 2 citations
A Novel Method for Reversible Bonding by Surface Charges Implanted on Parylene Film Through Corona Discharge · IEEE International Conference on Emerging Electronics (ICEE), 2025
An out of Plane Bistable Beam Actuator Utilizing an in-Plane Curved Beam · IEEE International Conference on Emerging Electronics (ICEE), 2025
Design, Fabrication, and Characterization of an Air Dielectric Semi-Coaxial Line · IEEE Transactions on Components Packaging and Manufacturing Technology, 2025 · 1 citations
Low-Cost Disposable Microglow Discharge Chip on Paper Substrate for Aqueous Sample Analysis · International Conference on Solid-State Sensors, Actuators and Microsystems, 2025

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